• January 29, 2019

Attend BISTel Live Webinar upcoming Jan 29th: Full Trace Analytics

BISTel-Webinar-2019-JAN

Attend BISTel Live Webinar upcoming Jan 29th: Full Trace Analytics

Attend BISTel Live Webinar upcoming Jan 29th: Full Trace Analytics 1024 576 BISTel

Tuesday, January 29, 2019 | 10AM PT/1PM EST
Wednesday, January 30, 2019 | 3AM KST

Overview:

In semiconductor manufacturing, traditional root cause analysis using FDC summary data is not always effective in solving complex issues, especially when the defect signals are too subtle to detect. Full trace analytics enables the discovery of these hidden signals.  This allows fab engineers to accurately pinpoint the root causes of yield-impacting issues. This webcast will discuss several use cases to showcase how advanced full trace analytics can help not only in provide accurate results, but can also simplify the root cause analysis process and reducing time-to-root-cause, resulting in better yields, lower production costs and increased engineering productivity.
In this LIVE webcast, BISTel’s Chief Product Management Officer, Gabe Villareal will discuss how BISTel is leading the industry with its new full trace analytics to simply root cause analysis, which enables fab engineers to pinpoint the issues than impact yield and productivity quicker than ever. Full trace analytics enables the comprehensive examination of process trace data to allow the detection of abnormalities and deviations to the finest details.

What You’ll Learn:

  • Learn how to improve yield and reduce risk with new full trace analytics to simply root cause analysis.
  • Hear why traditional root cause analysis using FDC summary data is not always effective in solving complex issues, especially when the defect signals are too subtle to detect.
  • Understand how full trace analytics enables the comprehensive examination of process trace data to allow the detection of abnormalities and deviations to the finest details.
  • Learn how these techniques can help not only provide accurate results, but can simplify the root cause analysis process and reduce time-to-root-cause. This results in better yields, lower production costs and increased engineering productivity.
About the Presenter: 

Gabe Villareal, Vice President, Global Product Management Group, BISTel

As Vice President Global Product Management (GPM) at BISTel, Mr. Villareal leads the company’s product development programs. He is largely responsible for bridging BISTel’s semiconductor industry leading Equipment Engineering Systems (EES) and its new adaptive intelligence (AI) applications for smart manufacturing.  Together,  these intelligent manufacturing solutions detect, analyze and predict answers  to everyday manufacturing challenges quicker and more effectively than ever.  Gabe and his team focus on helping engineers improve quality, productivity, wafer yields, and overall manufacturing effectiveness. For more than 20 years, Gabe has led engineering and product development teams to develop winning Equipment Engineering System (EES) and analytical solutions for the global semiconductor and FPD manufacturing industries. With the meteoric rise of IIoT, Big Data, Edge and Cloud Computing, Gabe and his team are being called on more than ever to support the semiconductor engineering community as they navigate in the age of AI and industry.

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