• September 13, 2017

BISTel to present at the e-Manufacturing and Design Collaboration Symposium 2017, Taiwan

1713-symposium

BISTel to present at the e-Manufacturing and Design Collaboration Symposium 2017, Taiwan

BISTel to present at the e-Manufacturing and Design Collaboration Symposium 2017, Taiwan 1024 683 BISTel

BISTel will be presenting at the 2017 e-Manufacturing and Design Collaboration Symposium (eMDC) on September 15 at the Ambassador Hotel in Hsinchu, Taiwan.

The eMDC event brings together experts and researchers from different fields to share their latest developments, break-through advancements, practical experiences and innovative ideas. This year’s theme is EMBA (Engineering, Manufacturing, Business, Artificial) intelligence in semiconductor manufacturing.

As one of the invited speeches of the event, the BISTel presentation will provide examples on how Artificial Intelligence has made its way into today’s FDC systems and a preview of how it will continue to expand FDC capabilities in the future.

For more information on this event:  http://www.tsia.org.tw/seminar/eManufacturing2017/

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