• February 14, 2018

BISTel to participate in FOA Collaborative Forum 2018 

News-release_FOA2018_EN

BISTel to participate in FOA Collaborative Forum 2018 

1024 778 BISTel

BISTel will be participating in this year’s Fab Owners Association (FOA) Collaborative Forum which will take place in Scottsdale, Arizona on February 21 – 22.

This annual event brings together semiconductor device makers, associate members, and suppliers to share their collaborative success through case studies, presentations, and discussions.

BISTel will be a proud sponsor of the Device Maker Lunch at this year’s forum.

See the link below for more information about the event: http://waferfabs.org/?q=node/11242

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