• February 7, 2017

BISTel to present at FOA Collaborative Forum 2017

1704-FOA-Collaborative-Forum

BISTel to present at FOA Collaborative Forum 2017

BISTel to present at FOA Collaborative Forum 2017 1024 576 BISTel

BISTel will be presenting at this year’s Fab Owners Association (FOA) Collaborative Forum which will take place in San Jose, California on February 22 – 23.   This annual event brings together device makers and associate members, including suppliers, to share their collaborative joint successes with case studies and presentations. In addition, invited presenters and industry analysts will participate in discussions and share their thoughts on semiconductor market trends and new technologies.

Along with being one of the sponsors for this year’s event, BISTel will be joining one of its key U.S. customers in presenting the capabilities of a new fault detection solution and showing how the product has helped the customer in improving the quality of their products and increasing productivity.

Please see the link below for more information about the event: http://www.waferfabs.org/?q=node/4512

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